03 Dec Devices packaging and thermal control optimization
Optimize packaging of electronic devices while assuring proper thermal control is a major challenge. Computational Fluid Dynamics provides quantitative and qualitative insights that can be a game changer in this context.
Here is reported one of our Webinars (full list available here). It explains how Computational Fluid Dynamics works and how to easily setup a CFD simulation where thermal control is analyzed in details starting from device geometry and input data (such as power consumption, fan air flow, etc.).
Our web application can effectively simulate operational conditions, highlighting problems and shortcomings in the design in the very preliminary phase.
If after the webinar you want to try to simulate your device yourself, our WELCOME Plan is free and gives you access to the full power of our platform.
CONSELF wants to make state of the art, cutting edge technology, available to every professional in the globe.
CFD simulation software is a very powerful tool, with its adoption optimization and innovation can be achieved in every field. To make this instrument accessible to everyone means lowering costs, but mainly to develop an infrastructure that favours a super-easy adoption by market new entrants.
CONSELF is highly committed and will pursue this goal working side by side with professional and industries to define the best strategies and solutions.
Alessandro Palmas – email@example.com – +39 370 129 26 75